IoT Wi-Fi

IoT Wi-Fi

AcSiP Technology Corp. AcSiP Technology Corp.
Data Processing & Storage
Application Processors & System on Chips (SOC)
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DESCRIPTION
AI7697HD is a highly integrated SIP module which features an application processor, a low power 1x1 11n Dual-band Wi-Fi subsystem, a Bluetooth subsystem, and a Power Management Unit. The application processor subsystem contains an ARM Cortex-M4F MCU, which has many peripherals, including UART, I2C, SPI, I2S, PWM, IrDA, and auxiliary ADC. AI7697HD also includes embedded SRAM/ROM and an external 4MB serial flash.
Home Appliances
Home Automation
Smart Gadget
IoT Bridge
Cloud Connectivity
GENERAL SPECIFICATIONS
AI7697HD is a highly integrated SIP module which features an application processor, a low power 1x1 11n Dual-band Wi-Fi subsystem, a Bluetooth subsystem, and a Power Management Unit. The application processor subsystem contains an ARM Cortex-M4F MCU, which has many peripherals, including UART, I2C, SPI, I2S, PWM, IrDA, and auxiliary ADC. AI7697HD also includes embedded SRAM/ROM and an external 4MB serial flash.
Home Appliances
Home Automation
Smart Gadget
IoT Bridge
Cloud Connectivity
AI7697HD is a highly integrated SIP module which features an application processor, a low power 1x1 11n Dual-band Wi-Fi subsystem, a Bluetooth subsystem, and a Power Management Unit. The application processor subsystem contains an ARM Cortex-M4F MCU, which has many peripherals, including UART, I2C, SPI, I2S, PWM, IrDA, and auxiliary ADC. AI7697HD also includes embedded SRAM/ROM and an external 4MB serial flash.
Home Appliances
Home Automation
Smart Gadget
IoT Bridge
Cloud Connectivity
May 01, 2015 (3 years ago)
Semiconductor SiP module (LGA type) + external metallic shield casing
3.3VDC typ.
13 months from shipping date
85 celsius (C) 185 fahrenheit (F)
-40 celsius (C) -40 fahrenheit (F)
0.08 inches (") 0.2 centimeters (cm) 2.03 millimeters (mm)
0.71 inches (") 1.8 centimeters (cm) 18.03 millimeters (mm)
0.71 inches (") 1.8 centimeters (cm) 18.03 millimeters (mm)
CE FCC

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