Accelerating the
Industrial Internet of Things

IoT Wi-Fi

IoT Wi-Fi

AcSiP Technology Corp. AcSiP Technology Corp.
Processors & Boards
System on Chip (SOC)
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DESCRIPTION
AI7697HD is a highly integrated SIP module which features an application processor, a low power 1x1 11n Dual-band Wi-Fi subsystem, a Bluetooth subsystem, and a Power Management Unit. The application processor subsystem contains an ARM Cortex-M4F MCU, which has many peripherals, including UART, I2C, SPI, I2S, PWM, IrDA, and auxiliary ADC. AI7697HD also includes embedded SRAM/ROM and an external 4MB serial flash.
Home Appliances
Home Automation
Smart Gadget
IoT Bridge
Cloud Connectivity
GENERAL SPECIFICATIONS
AI7697HD is a highly integrated SIP module which features an application processor, a low power 1x1 11n Dual-band Wi-Fi subsystem, a Bluetooth subsystem, and a Power Management Unit. The application processor subsystem contains an ARM Cortex-M4F MCU, which has many peripherals, including UART, I2C, SPI, I2S, PWM, IrDA, and auxiliary ADC. AI7697HD also includes embedded SRAM/ROM and an external 4MB serial flash.
Home Appliances
Home Automation
Smart Gadget
IoT Bridge
Cloud Connectivity
AI7697HD is a highly integrated SIP module which features an application processor, a low power 1x1 11n Dual-band Wi-Fi subsystem, a Bluetooth subsystem, and a Power Management Unit. The application processor subsystem contains an ARM Cortex-M4F MCU, which has many peripherals, including UART, I2C, SPI, I2S, PWM, IrDA, and auxiliary ADC. AI7697HD also includes embedded SRAM/ROM and an external 4MB serial flash.
Home Appliances
Home Automation
Smart Gadget
IoT Bridge
Cloud Connectivity
May 01, 2015 (4 years ago)
Semiconductor SiP module (LGA type) + external metallic shield casing
3.3VDC typ.
13 months from shipping date
85 celsius (C) 185 fahrenheit (F)
-40 celsius (C) -40 fahrenheit (F)
0.08 inches (") 0.2 centimeters (cm) 2.03 millimeters (mm)
0.71 inches (") 1.8 centimeters (cm) 18.03 millimeters (mm)
0.71 inches (") 1.8 centimeters (cm) 18.03 millimeters (mm)
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